In an exciting step toward global educational collaboration, the 13th Sino-European Engineering Education Platform (SEEEP) conference kicked off on October 27th at Dalian University of Technology (DUT). Bringing together nearly 100 leaders from top universities, government bodies, and industries across China and Europe, the conference set the stage for a new era of engineering education shaped by digital intelligence and cross-border partnership.
Under the vibrant theme “Digital and Intelligent Transformation: Industry, Education, and Innovation,” the event saw the unveiling of the SEEEP 2025 Roadmap. The document was jointly signed by Professor Gao Xiang, President of DUT, and Professor Stefano Paolo Corgnati, Rector of Politecnico di Torino and European Chair of SEEEP.
“This roadmap is not only a milestone—it’s our shared commitment to empowering the next generation of engineers and innovators,” said President Gao Xiang. “Together, we are building an education ecosystem that embraces intercultural understanding, interdisciplinary skills, and a profound sense of global responsibility.”
The conference featured inspiring keynote speeches, dynamic panel discussions, and specialized forums on cutting-edge topics such as AI in education, sustainable energy, robotics, and smart materials. Attendees also experienced DUT’s innovative learning environments firsthand through visits to the university’s History Museum, Engineering Training Center, and local high-tech enterprises.
Throughout the event, DUT strengthened ties with European partners including Politecnico di Torino, KTH Royal Institute of Technology, and Instituto Superior Técnico, laying a solid foundation for future student exchanges, research collaboration, and joint academic programs.
With the SEEEP 2025 Roadmap as a guiding framework, the conference reinforced a shared vision for a more integrated and forward-looking engineering education ecosystem between China and Europe.
